Advancement of ECAPed on the thermal stability of strain hardening behaviour and conductivity in an AA5083 under thermal effect

Nagendra Singh; Manoj Kumar Agrawal

doi:10.59400/mea1888

Advancement of ECAPed on the thermal stability of strain hardening behaviour and conductivity in an AA5083 under thermal effect

Nagendra Singh
1 Department of Mechanical Engineering, GLA University, Mathura UP-281406, India

2 Department of Mechanical Engineering, Institute of Engineering and Technology, Khandari Campus, Agra UP-282002, India
Manoj Kumar Agrawal
Department of Mechanical Engineering, GLA University, Mathura UP-281406, India

Article ID: 1888

DOI: https://doi.org/10.59400/mea1888

Keywords: AA5083, ECAP, elastic anisotropy, strain hardening

Abstract

The plastic distortion of AA5083 after ECAP Process was founded under stress at thermal limit from 6.2 to 420 K. The EBSD method was used to investigated the microstructure changes during loading such as the kernel average misorientation mappings and orientation. The microstructure is distinguished by grains with many dislocations and small misorientation angles. When a piece is deformed at 130 K and density of deformation faults increases at 310 K than decreases. The yield strength mentioned thermal sensitivity shows that thermal energy starts the plastic deformation. A reduction in the removal of dislocations because of a reduction in atomic movement and increase in increased flexibility followed by a faster rate of strain hardening and durability of polycrystals as the temperature drops. The investigation of stress-strain graphs and the evolution of microstructure show that the thermally induced process of dominant less than 185 K. The activity of recovery processes has increased. The aim of this study is to examine the process of applying severe plastic deformation techniques, namely equal channel angular pressing, to achieve a nanoscale structure in AA5083. The effects of applying equal channel angular pressing on the microstructure and mechanical characteristics of AA5083 were investigated. Scanning electron microscopy was employed to analyze the changes in microstructure resulting from various thermal treatments applied to the material subjected to severe plastic deformation through this process. Furthermore, a more profound comprehension of the modifications in the mechanical characteristics of this aluminium alloy was obtained.

Published

2025-08-16

How to Cite

Singh, N., & Agrawal, M. K. (2025). Advancement of ECAPed on the thermal stability of strain hardening behaviour and conductivity in an AA5083 under thermal effect. Mechanical Engineering Advances, 3(3). https://doi.org/10.59400/mea1888

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Issue

Vol. 3 No. 3 (2025)

Section

Review

This work is licensed under a Creative Commons Attribution 4.0 International License.

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